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Design Envelope Evercool by Armstrong Fluid Technology
Design Envelope Evercool is an automation platform for mission-critical cooling systems. The platform offers pre-engineered, feature-rich options that can be configured on site, and it meets the requirements of the Uptime Institute for Tier III data centers, while avoiding requirements for extensive site programming and customization. It also reduces site commissioning time by up to 30 percent and reduces overall energy use, coordinating cooling-system operation to reduce energy costs by up to 40 percent. The platform features internal redundancy and a hot-standby controller for continuous uptime, which ensures transfer in less than 200 milliseconds between controllers in the event of a failure.